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Heat Dissipation Material Operating Principle
Thermal Interface Material [TIM]
Thermal interface material (TIM) fills microscopic voids to facilitate heat transfer.
  • Matrix

    1) Roles: shape maintenance, cohesion, adhesion

    2) Types: silicone, epoxy, urethane, acryl, etc

  • Filler

    1) Roles: heat transfer, electrical conduction/insulation

    2) Types: ceramic, metal, carbonaceous materials, etc.

Heat Dissipation Solutions
  • 01
    Polymer Sheet

    - High thermal conductivity

    - Uniform temperature maintained at the edge of the wafer during high-temperature processing

    - Semiconductor yield ↑

  • 02
    Conductive Sheet

    - Thermal conductivity/electrical properties

  • 03
    Cryogenic Sheet

    - High heat and cold resistance

    - Uniform temperature maintained at the edge of the wafer during low-temperature processing

    - Semiconductor yield ↑

  • 04
    LAMI Equipment

    - Productivity improved through removal of air bubbles

    - Process improvement (semi-automation)

    - Improved work standards and work efficiency

Materials Technology
  • 01
    We have material mixing technology for optimal heat dissipation performance.
  • 02
    We have a variety of facilities for accurate reliability testing
  • 03
    We maintain price competitiveness through local production of heat-dissipation materials.
  • 04
    We develop customized materials for our customers
  • 05
    We have a material analysis system.